|
CeBIT New Product Release:
Thermaltake release the
Flagship CPU Cooler--MaxOrb
Thermaltake, the world’s leading
manufacturer of high-end PC
chassis, high-efficiency
power supply and CPU cooling
solution, today announced
the next generation of air
cooling solution, MaxOrb.
Founded on the proven heat
sink design of the original
Thermaltake Orb Series
cooler, radial fins take on
increased fin capacity to
accelerate rate of heat
dissipation for enhanced
cooling capability. MaxOrb
will support all mainstream
and high performance
processors (Intel LGA775 and
AMD Socket AM2/940/939/754).
“Enthusiasts are looking for
total cooling solution for
their systems,” said Dicky
Liu, senior thermal engineer
of Thermaltake. “The new
developed Radial Heat-TransferTM
Technology not only cools
the CPU, it also cools the
VRM around the CPU socket to
enhance system performance.”
Radial Heat-TransferTM
Technology not only allows
heat to be dissipated at a
faster rate, but also
decreases the pressure
buildup around fan blades to
minimize noise output. Air
channel created by radial
fins also directs airflow to
surrounding components for
added cooling; thus
increasing stability of
system and overclocking
capability.
Independent Channel Heatpipe
CoolingTM Technology
utilizes 6 independent
heatpipes to evenly
distribute heat to all
attached fins. Effectively
taking full advantage of
stacked fins around the heat
sink unit for unprecedented
cooling capability. Mirror
finished copper base further
increases the heat
absorption rate to remove
heat from processors.
Oversized blue LED fan with
VR fan control function
gives user full control over
the fan speed and exhibits
an unique yet subtle
futuristic look that will
surely to catch the
attention of any PC
enthusiasts and overclockers.
Check here for more news
info
about
MaxOrb:
MaxOrb
|
