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Universal
Heatpipe x6
Performance
Low Noise

Patent Information
Country Patent No.
Taiwan
M 245740
China
ZL 2003 2 0100605.5
200520143163.1

Best performance, supports up to TDP 130W.
Heatsink:
 
- 6 heatpipes, maximized heat transfer.
 
- High density of aluminum fins, provides large surface for heat dissipation.
 
- Seamless soldering process and large copper base provide good contact for heat conductivity
 
- Waved fins to reduce wind shear noise.
3 in 1 application
- For LGA775: push pin design for faster install.
 
- For K8 and latest socket AM2, tool-less clip, easy to install.
VR Fan
- Silent and powerful VR fan, 16dBA at minimum fan speed.
- Adjustable fan control to boost cooling performance.



Application:
For LGA775
For K8
For AM2
 
Detailed Feature:
Waved aluminum fins Copper base
Tt fan grill Heatpipes
Heatpipes VR controller
 
Dimension:

Model CL-P0310-01
Compatibility
Intel Core 2 Exterme(Socket LGA775)
Intel Core 2 Duo (Socket LGA775)
Intel Pentium Extreme Edition (Socket LGA 775)
Intel Pentium D (Socket LGA 775)
Intel Pentium 4 (Socket LGA775)
Intel Celeron D (Socket LGA775)
AMD Athlon 64 X2 (Socket 939, AM2)
AMD Athlon 64 FX (Socket 939, AM2)
AMD Athlon 64 (Socket 754, 939, AM2)
AMD Sempron (Socket 754, AM2)
Heatsink Dimension
122(L) x 122(D) x 103(H) mm
Heatsink Material
Copper Base & Aluminum Fin (142Fin)
Heatpipe
Copper Tube 6mm x 6 pcs
Weight
822g
Fan Dimension
120x120x25 mm
Rated Voltage
12V
Started Voltage
7V
Power Input
3.00W
Fan Speed
1300 ~2000 RPM
Max. Air Flow
86.5CFM
Max. Air Pressure
2.22mmH2O
Noise
16dBA~24dBA
Life Expectation
30,000hrs
Connector
3 Pin





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"Tt", Thermaltake, Thermaltake are trademarks of Thermaltake Technology Co., Ltd.
All other registered trademarks belong to their respective companies.